Combined Semiconductor, Inc. utilizes its core technology, Indium Phosphide, to manufacture advanced next generation devices for AI, defense, aerospace and data mining applications.  

Combined Semiconductor provides both front-end and back-end Indium Phosphide processes including optical packaging and testing.  .  Our goal is to drive progress in the photonics industry by utilizing compound semiconductor materials and providing innovative solutions for the AI revolution. 

Advanced optical packaging isa critical part of the manufacturing process. By providing this service in our own facility, we avoid shipping devices to several different places to manufacture a finished product and gives CSI complete control over the entire manufacturing process, . It also provides another service to customers that don’t have this technology. 
 
We are committed to delivering advanced technology that meets the unique needs of our customers.